On August 31, 2023, the 15th China Shenzhen Innovation and Entrepreneurship Competition Longhua Qualifier and the 7th Longhua District Innovation and Entrepreneurship Competition Award Ceremony were successfully held in the International Conference Center of Jieshun Science and Technology Center, Longhua District, Shenzhen.
Warmly congratulate Shenzhen Hotchip Technology Co., Ltd. won the third prize of the seventh Longhua District Innovation and Entrepreneurship Competition!
The fierce competition with the outstanding enterprises and winning the third prize is the authoritative recognition of the R&D technology of the company by the Science and Innovation Conference, and also a strong motivation for the company to continue to work hard. In the future, Hotchip will continue to adhere to the status of the main body of innovation, drill key core technologies, improve technological innovation capabilities, and comprehensively shape a new advantage for the development of China’s scientific and technological undertakings and economic development to contribute to China’s strengths.
Founded in 2008, Hotchip is an IC enterprise focusing on the design and advanced packaging and testing of digital-analog hybrid chips, with more than a hundred related patents and more than a thousand product models.
Since its inception, adhering to the relentless pursuit of product performance and quality, we have insisted on technology-driven, long-cycle, high-barrier, Power+ product direction to provide innovative chips and technology support for many smart applications from consumer to commercial areas. At the same time, we firmly develop advanced packaging-related technologies and multi-IP fusion system architecture, and adopt 2.5D/3D stacking technology to integrate Chiplets with different structures and functions into one, which makes the chip have obvious advantages in terms of power consumption and cost.
At present, the company has gained recognition from first-tier customers and strong support from head industrial investors; we are committed to the digital-analog hybrid chip design and packaging and testing track continued deep plowing, for consumer PMIC, digital isolation ICs, high-precision ADCs, energy storage SiC chips, automotive SiC chips, automotive BMS chips, MEMS temperature sensors and other market demand to provide highly competitive standardized products, to provide customers with first-class quality semiconductor products, to provide customers with first-class quality semiconductor products. To provide customers with first-class quality semiconductor products.
Please note the source for reprints: https://hotchiptech.com/third-prize-of-innovation-and-entrepreneurship-competition/
