MEMS Airflow Pressure Switch Sensor MS2202AB-M10

MS2202AB-M10 features a compact 2.7×1.8mm package suitable for SMT applications and supports high-efficiency automated production. Additionally, it incorporates an oil-resistant film over the metal casing to enhance protection against oil and dust, thereby improving system reliability.

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MS2202AB-M10 is a MEMS airflow pressure switch sensor suitable for detecting the smoking status of atomizer. When the built-in MEMS chip senses the change of air pressure, the MEMS chip converts the change of air pressure into the change of capacitance, and the MEMS chip is connected to the input of the built-in capacitive airflow detection ASIC chip to determine the user’s operation behavior through the detection of capacitance change signals by the circuit of ASIC input and output the corresponding trigger high and low level signals. The ASIC input circuit detects the capacitance change signal to determine the user’s operation behavior and outputs the corresponding trigger high and low level signals. With ASIC design, there will not be the current MCU program’s crash phenomenon, nor will there be below the critical voltage caused by the chip can not be reset phenomenon; power-saving mode quiescent current ≤ 5uA, peripheral application circuit is simple.

1. Limited Parameters

Parameter Symbol Min. Typ. Max. Unit
Operating Temperature TOPR -40 85
Storage Temperature TSTG -40 125
Supply Voltage Vdd -0.3 5.5 V
ESD 2000 V

2. Performance Parameters

Unless otherwise specified, the conditions are VDD = 4.0V and TA = 25°C.

Symbol Meaning Condition Min. Typ. Max. Unit
P Operating Pressure -100 -200 Pa
VDD Operating Voltage Range 2.4 5 V
IQ Static Power Consumption 3 5 uA
Vol Output Low Voltage VDD = 3.7V, Load Resistance = 2.2KΩ VDD*15% V
Voh Output High Voltage VDD = 3.7V, Load Resistance = 2.2KΩ VDD*85% V
tFIRE Startup Delay Time Time from effective capacitance change to OUT rising 60 ms
tOFF Off Delay Time Time from microphone capacitance recovery to OUT falling 60 ms
tBLOW Reverse Blow Protection Time Duration of air blowing without triggering activation 15 s
tMAX Timeout Protection Time Maximum continuous activation time 12 s
SM Algorithm Resolution [1] 1/32
HBM ESD Protection Capability 2000 V

Note [1]: The theoretical maximum capacitance change rate that the internal algorithm of the chip can resolve. The actual resolution or sensitivity may be affected by external factors such as the PCB layout and surrounding components.

3. Typical Application Circuit Diagram

MS2202AB-M10 Typical Application Circuit

4. System Diagram

MS2202AB-M10 System Block Diagram

Unit: mm Unmarked Tolerance: ±0.1(mm)

ltem Dimension Tolerance(+/-) Units
Length(L) 2.75 0.1 mm
Width(W) 1.85 0.1 mm
Height(H) 0.95 0.1 mm
Acoustic Port(AP1) 0.2 0.05 mm
Acoustic Port(AP2) 0.5 0.05 mm
Pin Pin Name Description
1 NC /
2 Output Switch output
3 VDD Power supply
4 GND Ground

Note: All Ground Pin must be connected to the ground in end application.

5. Installation Diagram

MS2202AB-M10 Installation Diagram

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