Selected for the 2023 China Advanced Packaging and Testing Factory List

Hotchip’s Nanning and Shandong projects have been selected for the 2023 China Advanced Packaging and Testing Factory List.

With the rapid development of semiconductor technology, the importance of advanced packaging technology is increasingly prominent, like a rising star, illuminating the entire semiconductor field. This technology is not only an iteration and optimization of traditional packaging methods, but also opens up new possibilities for expanding chip functionality. Advanced packaging technology significantly increases interconnect density and speed by integrating multiple chips into one package, thereby achieving a significant improvement in functionality. Advanced packaging technology undoubtedly plays a crucial role in the development and production of semiconductor products.

According to the latest statistical data, there will be 175 advanced packaging and testing factories in China in 2023. This number not only reflects the rapid popularization and profound impact of advanced packaging technology in China, but also represents China’s rise and innovation capability in the global semiconductor manufacturing field. These enterprises have not only improved their core competitiveness but also made positive contributions to the healthy development of the global semiconductor industry chain by continuously researching and introducing advanced technologies, including two key projects of Hotchip Group.

One is Guangxi Huaxin Zhenbang Semiconductor Co., Ltd., which is jointly established by Nanning Production and Investment Group Co., Ltd. and Shenzhen Huaxin Bang Technology Co., Ltd. It is a national key development project, and Huaxin Zhenbang is the first integrated circuit wafer level packaging and testing manufacturing project in Guangxi.

As a leading enterprise in the semiconductor manufacturing field in Guangxi, Huaxin Zhenbang builds its core competitiveness through technological innovation, adheres to the development strategy of “innovation driven”, regards key technological breakthroughs as the driving force for long-term development, and connects the industrial chain of integrated circuit wafer level packaging and testing and integrated innovation projects in Nanning.

The other is Shandong Yuanci Huaxin Integrated Circuit Co., Ltd., located in the High tech Zone of Liaocheng City, Shandong Province. It is affiliated with Hotchip Group and was jointly introduced by Liaocheng High tech Zone and Liaocheng Industry Research Institute. It is a semiconductor integrated circuit advanced packaging industrialization project invested and constructed by Shenzhen Hotchip Technology Co., Ltd.

Shandong Yuanci Huaxin Integrated Circuit Co., Ltd. was established in 2022 with a registered capital of 30 million yuan and a planned total investment of 110 million yuan. Its product line includes advanced FOIP fanout heterogeneous integration packaging, MEMS sensor packaging, and consumer grade frame packaging. The production process covers chip loading, wire bonding, glue dispensing, plastic packaging, tinning, printing, rib cutting, FT, SMT, etc.

It is reported that as early as 2023, Hotchip invested 530 million yuan in the FOiP heterogeneous integrated fanout advanced packaging project and successfully signed a contract to settle in Liaocheng High tech Zone, Shandong. The advanced packaging and testing base for silicon carbide chips invested and constructed in Liaocheng will become a manufacturer in Shandong Province specializing in advanced packaging and testing of silicon carbide chips. This not only marks a major leap forward for Hotchip in the field of advanced packaging technology, but also a significant measure for Liaocheng, Shandong to attract high-tech enterprises and promote regional economic development.

The following is the list of advanced packaging and testing factories in China for the year 2023 (data may change with the improvement and revision of research, and the following data does not represent the final sample):

Intel Chengdu closed beta testing base

Aisikai Hynix Semiconductor (Chongqing) Co., Ltd

Huanxu Electronics Co., Ltd

Samsung (China) Semiconductor Co., Ltd

Micron Semiconductor (Xi’an) Co., Ltd

Texas Instruments Semiconductor Manufacturing (Chengdu) Co., Ltd

Shanghai Ankao Packaging and Testing Company

NXP Semiconductors (Tianjin) Co., Ltd

Samsung Electronics (Suzhou) Semiconductor Co., Ltd

Weixun United Semiconductor (Texas) Co., Ltd

Wuhan Xinxin Integrated Circuit Co., Ltd

Xingke Jinpeng Semiconductor (Jiangyin) Co., Ltd

Qingdao New Core Technology Co., Ltd

Haitai Semiconductor (Wuxi) Co., Ltd

Shengdi Semiconductor (Shanghai) Co., Ltd

Quanxun RF Technology (Wuxi) Co., Ltd

Peidun Technology (Shenzhen) Co., Ltd

Suzhou Tongfu Chaowei Semiconductor Co., Ltd

Shenghejing Microelectronics (Jiangyin) Co., Ltd

Yongsi Electronics (Ningbo) Co., Ltd

Huatian Technology (Nanjing) Co., Ltd

Yuxin (Chengdu) Integrated Circuit Packaging and Testing Co., Ltd

Hongmao Microelectronics (Shanghai) Co., Ltd

Quanzhou Quliang Electronics Co., Ltd

Nantong Tongfu Microelectronics Co., Ltd

Hefei Peidun Storage Technology Co., Ltd

Silicon Products Technology (Suzhou) Co., Ltd

Huatian Technology (Xi’an) Co., Ltd

Changdian Integrated Circuit (Shaoxing) Co., Ltd

Huizhou Baiwei Storage Technology Co., Ltd

Qizhong Technology (Suzhou) Co., Ltd

Dior Technology (Chengdu) Co., Ltd

Huatian Technology (Kunshan) Electronics Co., Ltd

JCAP

Hefei Xinhuicheng Microelectronics Co., Ltd

Sun Moon New Semiconductor (Suzhou) Co., Ltd

Yantai Ruichuang Micro Nano Technology Co., Ltd

Jinglong Technology/Suzhou Zhenkun

Guizhou Zhenhua Fengguang Semiconductor Co., Ltd

Rirong Semiconductor (Shanghai) Co., Ltd

Shenzhen Saiyifa Microelectronics Co., Ltd. (STMicroelectronics Semiconductor)

Shandong Xinhengguang Technology Co., Ltd

Changdian Technology (Suqian) Co., Ltd

Hefei Tongfu Microelectronics Co., Ltd

Sun Moon New Semiconductor (Kunshan) Co., Ltd

Taiji Semiconductor (Suzhou) Co., Ltd

GoerTek Microelectronics Co., Ltd

Weixun United Semiconductor (Beijing) Co., Ltd

Sun Moon Packaging Testing (Shanghai) Co., Ltd

Shanghai Weichai Semiconductor Technology Co., Ltd

Sun Moon Integrated Circuit Manufacturing (China) Co., Ltd

Jiangsu Xinde Semiconductor Technology Co., Ltd

Suzhou Jingfang Semiconductor Technology Co., Ltd

Guangxi Guixin Semiconductor Technology Co., Ltd

Tongfutongke (Nantong) Microelectronics Co., Ltd

BYD Semiconductor Co., Ltd

Shengke Nano (Suzhou) Co., Ltd

Xiamen Tongfu Microelectronics Co., Ltd

Suzhou Keyang Semiconductor Co., Ltd

Xixing (Suzhou) Integrated Circuit Technology Co., Ltd

Chengdu Jijia Technology Co., Ltd

Lixin Precision Intelligent Manufacturing (Kunshan) Co., Ltd

Lijing Microelectronics Technology (Jiangsu) Co., Ltd

Shanghai Hualing Integrated Circuit Technology Co., Ltd

Xinquan (Nanjing) Integrated Circuit Co., Ltd

Wuxi Zhongwei High tech Electronics Co., Ltd

Jiangsu Napes Semiconductor Co., Ltd

Sichuan HeEntai Semiconductor Co., Ltd

China Resources Runan Technology (Chongqing) Co., Ltd

Leyven Semiconductor (Dongguan) Co., Ltd

Shanghai Minai Semiconductor Co., Ltd

Zhenjiang Sijia Testing Technology Co., Ltd

Fengqi Technology Co., Ltd

Ance Semiconductor Technology (Yiwu/Jiangsu)

Hefei Qizhong Technology Co., Ltd

Xinyun Semiconductor Technology Co., Ltd. (Zhuji/Hangzhou)

Hangzhou Lucent Technologies Co., Ltd

Jiangsu Zhongke Zhixin Integrated Technology Co., Ltd

Beijing Quean Technology Co., Ltd

Shenzhen Shi Chuangyi Electronics Co., Ltd

Ningbo Xinjian Semiconductor Co., Ltd

Tianxin Interconnect Technology Co., Ltd. (Wuxi+Shenzhen)

Shandong Qixin Microsystems Technology Co., Ltd

Yuancheng Technology (Suzhou) Co., Ltd. (Yuancheng Suzhou)

Wuxi Zhongwei Tengxin Electronics Co., Ltd

Huajin Semiconductor Packaging Leading Technology R&D Center Co., Ltd

Shanghai Yuexin Semiconductor Technology Co., Ltd

Changsha Anmuquan Intelligent Technology Co., Ltd

Hunan Yuemo Advanced Semiconductor Co., Ltd

Chizhou Huayu Electronic Technology Co., Ltd

Shanghai Liyangchuang Chip Testing Co., Ltd

Dongguan Liyang Chip Testing Co., Ltd

Guangxi Huaxin Zhenbang Semiconductor Co., Ltd

Zhejiang Hexin Integrated Circuit Co., Ltd

Zhejiang Jimaike Microelectronics Co., Ltd

Suzhou Ruijie Micro Technology Group Co., Ltd

Beijing Sai Microelectronics Co., Ltd

Xiamen Yuntian Semiconductor Technology Co., Ltd

Jiangsu Jingdu Semiconductor Technology Co., Ltd

Wuxi Huarun Ansheng Technology Co., Ltd

Hefei Ximai Microelectronics Technology Co., Ltd

Zhejiang Jiachen Semiconductor Co., Ltd

Foshan Blue Arrow Electronics Co., Ltd

Suzhou Gongjin Microelectronics Technology Co., Ltd

Wuxi Mole Elite Microelectronics Technology Co., Ltd

Jiaxing Weifu Semiconductor Co., Ltd

Suzhou Jieyanxin Electronic Technology Co., Ltd

Tianxin Interconnect Technology Co., Ltd. Wuxi Branch

Chengdu Yicheng Technology Co., Ltd

Hangzhou Jingtong Technology Co., Ltd

Sichuan Silicon Core Micro Technology Co., Ltd

Kunshan Sun Moon Semiconductor Co., Ltd

Nissin Semiconductor Technology (Shanghai) Co., Ltd

Suzhou Biyu Chongguang Semiconductor Co., Ltd

Jiangsu Aisi Semiconductor Technology Co., Ltd

Hangzhou Xinhai Semiconductor Technology Co., Ltd

Suzhou Senwan Electronic Technology Co., Ltd

Suzhou Gude Electronics Co., Ltd

Xiamen Sanan Integrated Circuit Co., Ltd

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd

Triassic (Guangdong) Technology Co., Ltd

Changdian Microelectronics (Jiangyin) Co., Ltd

Jingwang Semiconductor (Xiamen) Co., Ltd

Konka Semiconductor Cloud Technology (Yancheng) Co., Ltd

Shanghai Yibu Semiconductor Co., Ltd

Anhui Fengxin Semiconductor Co., Ltd

Shenzhen Zhongke Sihe Technology Co., Ltd

Xiamen Sihe Microelectronics Co., Ltd

Guangdong Yuehai Integrated Technology Co., Ltd

Wuhan Gaoxin Technology/Zhigan Technology

Silicon Pan Microelectronics (Chongqing) Co., Ltd

Hubei Tongge Microcircuit Technology Co., Ltd

Yixin Semiconductor Co., Ltd

Chengdu Wanying Microelectronics Co., Ltd

Suzhou Fuyi Electronic Technology Co., Ltd

Yixin Integrated Circuit (Yiwu) Co., Ltd

Ningbo Tairuisi Microelectronics Co., Ltd. (Headquarters)

Liance Youte Semiconductor (Yantai) Co., Ltd

Sichuan Qisai Microelectronics Co., Ltd

Zhongwei Advanced Packaging Technology (Heshan) Co., Ltd

Shenzhen Advanced Packaging Technology Co., Ltd

Shanghai Huatian Integrated Circuit Co., Ltd. (formerly known as Era Microelectronics)

Tongfu Chaowei (Suzhou) Microelectronics Co., Ltd

Huatian Technology (Jiangsu) Co., Ltd

Liance Youte Semiconductor (Shanghai) Co., Ltd

Hefei Xintou Microelectronics Co., Ltd

Rongxin Semiconductor (Ningbo) Co., Ltd

Hangzhou Daoming Microelectronics Co., Ltd

Hefei Zhongke Island Crystal Technology Co., Ltd

Changdian Technology Automotive Electronics (Shanghai) Co., Ltd

Huatian Advanced (Nanjing)

Jiangsu Pangu Semiconductor Technology Co., Ltd

Tongfu Tongda (Nantong) Microelectronics Co., Ltd

Zhejiang Shenhu Technology Co., Ltd

Huzhou Chanxin Technology Development Co., Ltd

Geko Microelectronics (Zhejiang) Co., Ltd

Zhejiang Weiti Integrated Circuit Co., Ltd

Zhaoming Semiconductor (Zhejiang) Co., Ltd

Jingwang Semiconductor (Shandong) Co., Ltd

Henan Lingcun Intelligent Manufacturing Co., Ltd

Loongson Zhongke (Hebi) Technology Co., Ltd

ASB Advanced Packaging Testing Base Project

Qingdao Xinhengyuan Intelligent Manufacturing Co., Ltd

Wuyuan Semiconductor Technology (Qingdao) Co., Ltd

Beijing Huafeng Jixin Electronics Co., Ltd

Shengke Nano (Qingdao) Co., Ltd

Hotchip Semiconductor Advanced Packaging Industrialization Project

Zhuhai Tiancheng Advanced Semiconductor Technology Co., Ltd

Guangdong Xincheng Hanqi Semiconductor Technology Co., Ltd

Shenzhen Jingcun Technology Co., Ltd

Sun Moon New Semiconductor (Guangzhou) Co., Ltd

Wuhan Xinchuangyuan Semiconductor Co., Ltd

According to statistics, foreign companies in China account for 75.98% of the total revenue of the advanced packaging and testing industry. This data undoubtedly reflects the technological advantages of foreign-funded enterprises and their dominant position in market share. Although foreign-funded enterprises occupy a dominant position in this field, the rise of local enterprises should not be underestimated. Chinese domestic enterprises have shown strong growth momentum in the field of advanced packaging and testing. By continuously increasing investment in technology research and development, enhancing independent innovation capabilities, local enterprises are gradually narrowing the technological gap with foreign-funded enterprises. In 2023, excluding foreign revenue in China, the total revenue of local enterprises reached 74.8 billion yuan, which is full of endless hope and potential, demonstrating their gradual rise in the market.

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