The project of incubating the KOOM team at Hotchip has won the second prize in the 2nd China ASEAN Innovation and Entrepreneurship Competition, as we strive to ride the waves towards ASEAN.
The final of the 2nd China ASEAN Innovation and Entrepreneurship Competition was successfully concluded on May 15, 2024 in Jakarta, the capital of Indonesia. It has been included in the concept document of the China ASEAN Year of Cultural Exchange and is one of the important activities of the Year.
The theme of this competition is “Digital Empowerment, Shared Future”, highlighting the digital economy. Since its launch in July 2023, more than 280 projects have registered for competition. After intense competition, a total of 20 outstanding innovation and entrepreneurship projects from countries and regions such as China, Indonesia, Malaysia, the Philippines, Thailand, Vietnam, Cambodia, and Brunei stood out and advanced to the finals, divided into two paths: team group and enterprise group.
The KOOM team project, incubated by Shenzhen Hotchip Technology Co., Ltd., titled “The HRP Technology Derived from Wafer Level Chip Scale Packaging to Improve Digital Products Modular Manufacturing,” based on wafer level chip level packaging, broke through the finals and won the second prize with 82.8 points.
The competition adopts full English explanation and defense. The judges focus on core key issues such as how the project will be implemented, its feasibility, risks and benefits, and the customer market after the project is successfully implemented. They comprehensively examine the feasible strategies and expected quality of the team’s project. The team members presented a clear and practical content plan to the judges, demonstrating the significant importance of the breakthrough points in the technical application of this project for ASEAN countries.
The HRP technology based on wafer level chip level packaging is extended to modular manufacturing of heterogeneous integration: it is to modularize PCBA chips and achieve modular manufacturing of various consumer electronics products in different product fields. Different components manufactured separately are integrated into higher-level components, simplifying the mechanical manufacturing process and improving worker operation efficiency.
China’s semiconductor industry is slightly behind that of the United States, and coupled with the recent imposition of tariffs on China’s semiconductor new energy by the United States, it indicates that some areas of China’s semiconductor industry are already quite strong, and the United States cannot bear it and can only take measures to impose tariffs. This is usually a mature process chip, with market demand accounting for over 70% of the total chip demand. One of the motivations behind the previous imposition of high tariffs on a large number of Chinese goods was to guide domestic manufacturing companies to return to the domestic market, thereby weakening China’s position in the global supply chain and disrupting its footsteps in high-end manufacturing and technology fields. It has also led to some processing and manufacturing industries relocating to Southeast Asian countries with lower labor costs for survival.
Under these factors, it has become crucial to address the difficulties faced by the manufacturing industry that has overflowed to Southeast Asia. The core of this competition project is also of milestone significance for manufacturing factories in Southeast Asian countries. It is not easy to achieve localized manufacturing of the project. This requires not only strong technical research and development support from Hotchip Technology, but also careful planning and layout for multiple aspects of the local market based on a deep understanding of the ASEAN market. As a pioneer in heterogeneous integrated chip technology, we have improved the performance and cost of single chips, integrated chiplets with more functional chips, and further modularized the PCBA of electronic products, truly achieving minimalist assembly of finished products and achieving a higher degree of automation. This technology fundamentally solves the difficulties in manufacturing, reduces labor costs, and improves product assembly yield, which is a major turning point and a higher level of economic prosperity for Southeast Asian manufacturing factories.
Using technological innovation and entrepreneurship as a bridge and competitions as a platform, establish a normalized mechanism for innovation and entrepreneurship docking, create the China ASEAN Innovation and Entrepreneurship Camp, deepen the exchange and cooperation of scientific and technological innovation between China and ASEAN countries, enhance the innovation capabilities of the China ASEAN region, stimulate innovation and entrepreneurship vitality, promote the two-way exchange of innovative elements such as scientific and technological achievements, financial capital, talent teams, and information data, promote the establishment of a closer future oriented technological innovation partnership between the two sides, and build a China ASEAN community with a shared future.
