About HOTCHIP

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Founded in 2008, Hotchip is a specialized integrated circuit/semiconductor enterprise focusing on mixed signal chip design and advanced packaging and testing. Its headquarters are located in Shenzhen, with chip R&D as well as process centers in Suzhou and Taipei. In Jiangsu, Shandong, and Guangxi, Hotchip has established its own advanced manufacturing centers for chip frame packaging, substrate packaging, and wafer-level packaging. With total assets exceeding 1 billion yuan, Hotchip is among the few domestic chip companies operating under the Fab-Lite model.

Based on the Group’s Fab-Lite model and driven by heterogeneous integration technology, Hotchip is committed to producing highly integrated, long-cycle, and high-barrier products. Its product line encompasses Power+ (power-related), MEMS+ (sensors-related), Display+ (display-related), and other commercial/consumer chips or modules. Leveraging its chip R&D and advanced packaging capabilities, Hotchip integrates chips with different structures and functions into a unified system architecture with multi-IP fusion, known as Chiplet, which significantly improves the chip’s power efficiency and cost advantages! On this basis, Hotchip modularizes various modules from different product areas into HIM (Heterogeneous Integration Module) , achieving chipification and modularization of PCBA, and providing customers with turn key chip solutions.

Since its establishment, Hotchip has received strategic investments from state-owned enterprises and recognition from leading suppliers/customers in the industry. In the future, the company will continue to solidify its foundation in chip research and development and manufacturing, unwaveringly pursuing its mission to make the world admire Chinese chips.

Member of Shenzhen High-Tech Industry Association
Vice President Unit of Shenzhen Electronic Chamber of Commerce
Member of Shenzhen Semiconductor Industry Association
Top Ten Brand Enterprise on Huaqiang Electronic Network
Vice President Unit of Guangdong High-Tech Industry Chamber of Commerce
Member of Guangdong Semiconductor Industry Association
Member of China Sensor and IoT Industry Alliance
Recognized as a "Shenzhen Famous Brand" in the 21st session

HOTCHIP

Industry-Academia-Research Collaboration Project

Xi’an Jiaotong-Liverpool University
Guilin University of Electronic Technology
Guangxi University
Jiangsu Normal University
Xuzhou University of Technology
Sun Yat-sen University School of Integrated Circuits

Partner Clients

Hotchip's Journey& Milestones

2023
Shenzhen Specialized and Innovative Enterprise;
Third Prize in Longhua District Innovation Competition;
Second Prize in Shenzhen Innovation Competition;
Officially launched overseas market expansion.
2022
Established Guangxi Hotchip Semiconductor Co., Ltd. in Nanning to develop advanced wafer-level chip packaging business.
2021
Achieved industry-university cooperation with Xi'an Jiaotong-Liverpool University to co-develop fourth-generation semiconductor AI chips.
2020
The Xuzhou Intelligent Factory has commenced production, offering full process capabilities from wafer testing and cutting to chip packaging.
2019

Signed an agreement with Jiangsu Xuzhou Airport Economic Development Zone Group to expand the packaging business.

2017
Awarded the "Excellence in Invention Patent" by the National Intellectual Property Administration;
In April, Hotchip's headquarters was invited to relocate to Bao'an Zhongliang Business Park, becoming a key signed project in Bao'an District;
In March, received the "Blue Dot Award for Innovative Technology Products" from the Shenzhen Electronics Chamber of Commerce;
In February, received industrialization funding and equity investment from the Shenzhen Development and Reform Commission.
2016
In December, awarded the "China Patent Excellence Award";
In April, received the honor of "Kunpeng 100 Leading Enterprise in Shenzhen".
2015
Received funding from the Nanshan District Science and Technology Innovation Commission for technical research projects, and further industrial and research funding from the Shenzhen Development and Reform Commission;
In December, received the "2015 LED Lighting Single Product Champion Award" from the China LED Lighting Champion Alliance;
In July, made a breakthrough in the key technology of wireless sensor network System on Chip (SoC) chips.
2014
In July, the company founder was recognized as a "High-level Professional Talent" in Shenzhen;
In June, Hotchip's LED driver products entered the well-known enterprise TCL Lighting Appliance Co., Ltd.;
In April, the overseas headquarters "Hotchip Technology Co., Ltd." was established, expanding into international markets;
In January, the company launched its first "wireless charging + power bank solution," entering the engineering validation phase.
2013
National High-Tech Enterprise Certification;
In December, awarded the "Most Influential Company in China's Electronics Industry" by HC360; In August, partnered with a VI design company to redesign the group's logo;
In August, Hotchip relocated its headquarters to Kexing Science Park in the Science and Technology Park and joined the Shenzhen High-Tech Industry Association;
In July, Hotchip was awarded the "National High-Tech Enterprise Certificate";
In May, Hotchip was listed on the Qianhai Equity Exchange Center;
In January, awarded the "Top 10 Brands in the Electronics Industry" by Huaqiang Electronics for 2012.
2012
In December, recognized as a "National Integrated Circuit Design Enterprise";
In November, the first integrated SoC chip for mobile power supplies was successfully mass-produced, earning industry recognition as the "pioneer of disrupting traditional mobile power MCU solutions"
2011
In October, awarded "China Electronics Supplier Credit Enterprise" by the China Electronics Chamber of Commerce and China Electronics Supplier Credit Assessment Committee;
In May, the company joined the Shenzhen Semiconductor Industry Association;
2010
The company's product line achieved an average monthly sales volume of 3,000 wafer units;
In January, the first batch of BCD process AC/DC products entered mass production;
2009
In November, established an industry-academia-research collaboration with Xidian University; In September, the first batch of CMOS process products entered mass production;
2008
Shenzhen Hotchip Technology Co., Ltd. was founded.
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