About HOTCHIP
Founded in 2008, Hotchip is a specialized integrated circuit/semiconductor enterprise focusing on mixed signal chip design and advanced packaging and testing. Its headquarters are located in Shenzhen, with chip R&D as well as process centers in Suzhou and Taipei. In Jiangsu, Shandong, and Guangxi, Hotchip has established its own advanced manufacturing centers for chip frame packaging, substrate packaging, and wafer-level packaging. With total assets exceeding 1 billion yuan, Hotchip is among the few domestic chip companies operating under the Fab-Lite model.
Based on the Group’s Fab-Lite model and driven by heterogeneous integration technology, Hotchip is committed to producing highly integrated, long-cycle, and high-barrier products. Its product line encompasses Power+ (power-related), MEMS+ (sensors-related), Display+ (display-related), and other commercial/consumer chips or modules. Leveraging its chip R&D and advanced packaging capabilities, Hotchip integrates chips with different structures and functions into a unified system architecture with multi-IP fusion, known as Chiplet, which significantly improves the chip’s power efficiency and cost advantages! On this basis, Hotchip modularizes various modules from different product areas into HIM (Heterogeneous Integration Module) , achieving chipification and modularization of PCBA, and providing customers with turn key chip solutions.
Since its establishment, Hotchip has received strategic investments from state-owned enterprises and recognition from leading suppliers/customers in the industry. In the future, the company will continue to solidify its foundation in chip research and development and manufacturing, unwaveringly pursuing its mission to make the world admire Chinese chips.
Member of Shenzhen High-Tech Industry Association
Vice President Unit of Shenzhen Electronic Chamber of Commerce
Member of Shenzhen Semiconductor Industry Association
Top Ten Brand Enterprise on Huaqiang Electronic Network
Vice President Unit of Guangdong High-Tech Industry Chamber of Commerce
Member of Guangdong Semiconductor Industry Association
Member of China Sensor and IoT Industry Alliance
Recognized as a "Shenzhen Famous Brand" in the 21st session
HOTCHIP
Industry-Academia-Research Collaboration Project
Xi’an Jiaotong-Liverpool University
Guilin University of Electronic Technology
Guangxi University
Jiangsu Normal University
Xuzhou University of Technology
Sun Yat-sen University School of Integrated Circuits
Partner Clients
Hotchip's Journey& Milestones
Signed an agreement with Jiangsu Xuzhou Airport Economic Development Zone Group to expand the packaging business.
In April, received the honor of "Kunpeng 100 Leading Enterprise in Shenzhen".
In June, Hotchip's LED driver products entered the well-known enterprise TCL Lighting Appliance Co., Ltd.;
In April, the overseas headquarters "Hotchip Technology Co., Ltd." was established, expanding into international markets;
In January, the company launched its first "wireless charging + power bank solution," entering the engineering validation phase.
In January, the first batch of BCD process AC/DC products entered mass production;